5 or less years experience Package SI/PI engineer
Strong Signal/Power Integrity fundamentals
Hands on experience in PCB modelling and Package modelling.
Experience in simulating (FD/TD) memory interfaces for Board and Package is required (DDR3/DDR4, LPDDR3/4)
Experience in simulating (FD/TD) High Speed Serial IO interfaces for Board and Packageis required (PCIe Gen3/4, RGMII...etc)
Good knowledge of Power Delivery Network, impedance profile analysis, IR Drop Analysis, modelling of PCB and Package Shapes andtime domain Analysis.
Should be able to provide practical solutions to PCB/Package design team based on simulation results and analysis.
Strong knowledge in simulation tools Specifically Readhawk and other tools Ansys SIwave, HFSS, Hspice, Sigrity(2.5D and 3D-EM Must) and ADS.
